CVE-2019-10622
Out of bound memory access can happen while parsing ADSP message due to lack of check of size of payload received from userspace in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8096AU, IPQ4019, IPQ6018, IPQ8064, IPQ8074, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, QCN7605, QCS605, SC8180X, SDM710, SDX24, SDX55, SM8150, SM8250, SXR2130
- Score
- CVSS 3.1 9.1 Critical
- Status
- Modified - product-security@qualcomm.com
- Published
- 2020-04-16
- Last modified
- 2024-08-04
- Weaknesses
- CWE-125
Affected products
- Apq8009 Firmware (Qualcomm)
- Apq8096au Firmware (Qualcomm)
- Ipq4019 Firmware (Qualcomm)
- Ipq6018 Firmware (Qualcomm)
- Ipq8064 Firmware (Qualcomm)
- Ipq8074 Firmware (Qualcomm)
- Mdm9206 Firmware (Qualcomm)
- Mdm9207c Firmware (Qualcomm)
- Mdm9607 Firmware (Qualcomm)
- Mdm9640 Firmware (Qualcomm)
- Mdm9650 Firmware (Qualcomm)
- Qcn7605 Firmware (Qualcomm)
- Qcs605 Firmware (Qualcomm)
- Sc8180x Firmware (Qualcomm)
- Sdm710 Firmware (Qualcomm)
- Sdx24 Firmware (Qualcomm)
- Sdx55 Firmware (Qualcomm)
- Sm8150 Firmware (Qualcomm)
- Sm8250 Firmware (Qualcomm)
- Sxr2130 Firmware (Qualcomm)
- Snapdragon Auto (Qualcomm Inc.)
- Snapdragon Compute (Qualcomm Inc.)
- Snapdragon Consumer Electronics Connectivity (Qualcomm Inc.)
- Snapdragon Consumer Iot (Qualcomm Inc.)
- Snapdragon Industrial Iot (Qualcomm Inc.)
- Snapdragon Mobile (Qualcomm Inc.)
- Snapdragon Wired Infrastructure And Networking (Qualcomm Inc.)
References
- https://www.qualcomm.com/company/product-security/bulletins/april-2020-bulletin
