CVE-2018-5881

Improper validation of buffer length checks in the lwm2m device management protocol can leads to a buffer overflow in snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 636, SD 835, SDA660, SDM630, SDM660

Score

CVSS 3.0 8.8 High

Status

Modified - product-security@qualcomm.com

Published

2019-01-18

Last modified

2024-08-05

Weaknesses

CWE-119

Affected products

• Mdm9206 Firmware (Qualcomm)
• Mdm9607 Firmware (Qualcomm)
• Sd 205 Firmware (Qualcomm)
• Sd 210 Firmware (Qualcomm)
• Sd 212 Firmware (Qualcomm)
• Sd 425 Firmware (Qualcomm)
• Sd 427 Firmware (Qualcomm)
• Sd 430 Firmware (Qualcomm)
• Sd 435 Firmware (Qualcomm)
• Sd 450 Firmware (Qualcomm)
• Sd 625 Firmware (Qualcomm)
• Sd 636 Firmware (Qualcomm)
• Sd 835 Firmware (Qualcomm)
• Sda660 Firmware (Qualcomm)
• Sdm630 Firmware (Qualcomm)
• Sdm660 Firmware (Qualcomm)
• Snapdragon Mobile (Qualcomm Inc.)
• Snapdragon Wear (Qualcomm Inc.)

References

• https://www.qualcomm.com/company/product-security/bulletins