CVE-2018-5878
While sending the response to a RIL_REQUEST_GET_SMSC_ADDRESS message, a buffer overflow can occur in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear.
- Score
- CVSS 3.0 9.8 Critical
- Status
- Modified - product-security@qualcomm.com
- Published
- 2018-07-06
- Last modified
- 2024-09-16
- Weaknesses
- CWE-119
Affected products
- Mdm9206 Firmware (Qualcomm)
- Mdm9607 Firmware (Qualcomm)
- Mdm9635m Firmware (Qualcomm)
- Mdm9650 Firmware (Qualcomm)
- Sd 205 Firmware (Qualcomm)
- Sd 210 Firmware (Qualcomm)
- Sd 212 Firmware (Qualcomm)
- Sd 415 Firmware (Qualcomm)
- Sd 615 Firmware (Qualcomm)
- Sd 616 Firmware (Qualcomm)
- Sd 625 Firmware (Qualcomm)
- Sd 835 Firmware (Qualcomm)
- Snapdragon Automobile (Qualcomm Inc.)
- Snapdragon Mobile (Qualcomm Inc.)
- Snapdragon Wear (Qualcomm Inc.)
References
- https://www.qualcomm.com/company/product-security/bulletins
