CVE-2018-11267

In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9615, MDM9640, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 600, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDX20, Snapdragon_High_Med_2016, when sending an malformed XML data to deviceprogrammer/firehose it may do an out of bounds buffer write allowing a region of memory to be filled with 0x20.

Score: CVSS 3.0 7.8 High
Status: Modified - product-security@qualcomm.com
Published: 2018-09-20
Last modified: 2024-08-05
Weaknesses: CWE-129

Affected products

Mdm9206 Firmware (Qualcomm)
Mdm9607 Firmware (Qualcomm)
Mdm9615 Firmware (Qualcomm)
Mdm9640 Firmware (Qualcomm)
Mdm9650 Firmware (Qualcomm)
Mdm9655 Firmware (Qualcomm)
Msm8996au Firmware (Qualcomm)
Sd205 Firmware (Qualcomm)
Sd210 Firmware (Qualcomm)
Sd212 Firmware (Qualcomm)
Sd410 Firmware (Qualcomm)
Sd412 Firmware (Qualcomm)
Sd415 Firmware (Qualcomm)
Sd425 Firmware (Qualcomm)
Sd427 Firmware (Qualcomm)
Sd430 Firmware (Qualcomm)
Sd435 Firmware (Qualcomm)
Sd450 Firmware (Qualcomm)
Sd600 Firmware (Qualcomm)
Sd615 Firmware (Qualcomm)
Sd616 Firmware (Qualcomm)
Sd617 Firmware (Qualcomm)
Sd625 Firmware (Qualcomm)
Sd650 Firmware (Qualcomm)
Sd652 Firmware (Qualcomm)
Sd820 Firmware (Qualcomm)
Sd820a Firmware (Qualcomm)
Sd835 Firmware (Qualcomm)
Sd845 Firmware (Qualcomm)
Sd850 Firmware (Qualcomm)
Sda660 Firmware (Qualcomm)
Sdm429 Firmware (Qualcomm)
Sdm439 Firmware (Qualcomm)
Sdm630 Firmware (Qualcomm)
Sdm632 Firmware (Qualcomm)
Sdm636 Firmware (Qualcomm)
Sdm660 Firmware (Qualcomm)
Sdx20 Firmware (Qualcomm)
Snapdragon High Med 2016 Firmware (Qualcomm)
Snapdragon Automobile (Qualcomm Inc.)
Snapdragon Mobile (Qualcomm Inc.)
Snapdragon Wear (Qualcomm Inc.)

References

http://www.securityfocus.com/bid/106128
https://www.qualcomm.com/company/product-security/bulletins