CVE-2017-18305

XBL sec mem dump system call allows complete control of EL3 by unlocking all XPUs if enable fuse is not blown in Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 835.

Score

CVSS 3.0 7.0 High

Status

Modified - product-security@qualcomm.com

Published

2018-10-23

Last modified

2024-08-05

Affected products

• Mdm9206 Firmware (Qualcomm)
• Mdm9607 Firmware (Qualcomm)
• Mdm9650 Firmware (Qualcomm)
• Sd 205 Firmware (Qualcomm)
• Sd 210 Firmware (Qualcomm)
• Sd 212 Firmware (Qualcomm)
• Sd 835 Firmware (Qualcomm)
• Snapdragon Mobile (Qualcomm Inc.)
• Snapdragon Wear (Qualcomm Inc.)

References

• http://www.securitytracker.com/id/1041432
• https://source.android.com/security/bulletin/2018-08-01#qualcomm-closed-source-components
• https://www.qualcomm.com/company/product-security/bulletins