CVE-2017-18140

In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Automobile, Snapdragon Mobile, and Snapdragon Wear MDM9206, MDM9607, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 808, SD 810, SD 820, SD 820A, SD 835, SD 845, when processing a call disconnection, there is an attempt to print the RIL token-id to the debug log. If eMBMS service is enabled while processing the call disconnect, a Use After Free condition may potentially occur.

Score

CVSS 3.0 9.8 Critical

Status

Modified - product-security@qualcomm.com

Published

2018-04-11

Last modified

2024-09-16

Weaknesses

CWE-416

Affected products

• Mdm9206 Firmware (Qualcomm)
• Mdm9607 Firmware (Qualcomm)
• Mdm9650 Firmware (Qualcomm)
• Msm8909w Firmware (Qualcomm)
• Sd 205 Firmware (Qualcomm)
• Sd 210 Firmware (Qualcomm)
• Sd 212 Firmware (Qualcomm)
• Sd 400 Firmware (Qualcomm)
• Sd 415 Firmware (Qualcomm)
• Sd 425 Firmware (Qualcomm)
• Sd 430 Firmware (Qualcomm)
• Sd 450 Firmware (Qualcomm)
• Sd 615 Firmware (Qualcomm)
• Sd 616 Firmware (Qualcomm)
• Sd 617 Firmware (Qualcomm)
• Sd 625 Firmware (Qualcomm)
• Sd 650 Firmware (Qualcomm)
• Sd 652 Firmware (Qualcomm)
• Sd 808 Firmware (Qualcomm)
• Sd 810 Firmware (Qualcomm)
• Sd 820 Firmware (Qualcomm)
• Sd 820a Firmware (Qualcomm)
• Sd 835 Firmware (Qualcomm)
• Sd 845 Firmware (Qualcomm)
• Snapdragon Automobile (Qualcomm Inc.)
• Snapdragon Mobile (Qualcomm Inc.)
• Snapdragon Wear (Qualcomm Inc.)

References

• http://www.securityfocus.com/bid/103671
• https://source.android.com/security/bulletin/2018-04-01