CVE-2017-17282
SCCP (Signalling Connection Control Part) module in Huawei DP300 V500R002C00, RP200 V500R002C00, V600R006C00, TE30 V100R001C10, V500R002C00, V600R006C00, TE40 V500R002C00, V600R006C00, TE50 V500R002C00, V600R006C00, TE60 V100R001C10, V500R002C00, V600R006C00 has a buffer overflow vulnerability. An attacker has to find a way to send malformed packets to the affected products repeatedly. Due to insufficient input validation, successful exploit may cause some service abnormal.
- Score
- CVSS 3.0 3.1 Low
- Status
- Modified - psirt@huawei.com
- Published
- 2018-03-09
- Last modified
- 2024-08-05
- Weaknesses
- CWE-119
Affected products
- Dp300 Firmware (Huawei)
- Rp200 Firmware (Huawei)
- Te30 Firmware (Huawei)
- Te40 Firmware (Huawei)
- Te50 Firmware (Huawei)
- Te60 Firmware (Huawei)
- Dp300 (Huawei Technologies Co. Ltd.)
- Rp200 (Huawei Technologies Co. Ltd.)
- Te30 (Huawei Technologies Co. Ltd.)
- Te40 (Huawei Technologies Co. Ltd.)
- Te50 (Huawei Technologies Co. Ltd.)
- Te60 (Huawei Technologies Co. Ltd.)
References
- http://www.huawei.com/en/psirt/security-advisories/huawei-sa-20180228-01-sccp-en
