CVE-2016-2063
Stack-based buffer overflow in the supply_lm_input_write function in drivers/thermal/supply_lm_core.c in the MSM Thermal driver for the Linux kernel 3.x, as used in Qualcomm Innovation Center (QuIC) Android contributions for MSM devices and other products, allows attackers to cause a denial of service or possibly have unspecified other impact via a crafted application that sends a large amount of data through the debugfs interface.
- Score
- CVSS 3.1 7.8 High
- Status
- Modified - cve@mitre.org
- Published
- 2016-08-07
- Last modified
- 2024-08-05
- Weaknesses
- CWE-119
Affected products
References
- http://www.securityfocus.com/bid/92381
- https://us.codeaurora.org/cgit/quic/la/kernel/msm-3.10/commit/?id=ab3f46119ca10de87a11fe966b0723c48f27acd4
- https://www.codeaurora.org/stack-overflow-msm-thermal-driver-allows-kernel-memory-corruption-cve-2016-2063
